| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for processing a wafer, capable of preventing the occurrence of cutting dusts including heavy metal by accidentally processing a columnar electrode when thining the wafer. <P>SOLUTION: A method for processing a wafer in which the wafer having columnar electrodes embedded therein is processed and thinned, includes the steps of: measuring the height of the columnar electrodes embedded in the wafer to obtain height data of the columnar electrodes (measuring step); relatively inclining a holding face of a holding table for holding the wafer and a processing face of processing means for processing a rear face of the wafer held by the holding table on the basis of the height data of the columnar electrodes obtained at the measuring step, to adjust a facing state between the holding face and the processing face and to hold the wafer by the holding table (wafer holding step); and thereafter processing the rear face of the wafer held by the holding table by using the processing means on the basis of the height data of the columnar electrodes, to thin the wafer so that the columnar electrodes are not exposed to the rear face of the wafer (wafer thining step). <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
