| 摘要 |
Provided are: a resin composition for sealing an electronic device, the resin composition capable of adequately suppressing penetration by water vapor; and an electronic device in which the resin composition for sealing an electronic device is applied. The present invention includes (A) a polybutadiene polymer represented by chemical formula (1) having a (meth)acryloyl group at a terminal end thereof, and (B) a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or greater. (In chemical formula (1), R1 and R2 each represent a hydroxyl group or H2C=C(R7)-COO-, R3 and R4 each independently represent a C1-C16 substituted or unsubstituted divalent organic group, R5, R6, and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1). In chemical formula (1), l and m each represent 0 or 1, n is an integer of 15-150, and x:y = 0-100:100-0. R1 and R2 are never both a hydroxyl group.) |
