用于提供互连半导体之中介层的方法与设备;METHODS AND APPARATUS FOR PROVIDING AN INTERPOSER FOR INTERCONNECTING SEMICONDUCTOR CHIPS

摘要

本发明提供用于在半导体封装中使一或更多个半导体晶片与有机基板互连之中介层的方法与设备，该中介层包括：第一玻璃基板，该第一玻璃基板具有第一主要表面及反面的第二主要表面，且该第一玻璃基板具有第一热膨胀系数(CTE1)；第二玻璃基板，该第二玻璃基板具有第一主要表面及反面的第二主要表面，且该第二玻璃基板具有第二热膨胀系数(CTE2)；及位在第一玻璃基板与第二玻璃基板之间的介面，且该介面接合第一玻璃基板的第二主要表面与该第二玻璃基板的第一主要表面，其中CTE1小于CTE2，该第一玻璃基板的第一主要表面用于衔接一或更多个半导体晶片，及该第二玻璃基板的第二主要表面用于衔接该有机基板。; a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.