像素化温度控制的基板支撑组件;PIXELATED TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY

摘要

本文所述之实施方式提供像素化基板支撑组件，该组件赋能静电夹盘与加热组件之间热传递之侧向及方位角调谐。像素化基板支撑组件包括上表面及下表面；安置于像素化基板支撑件中之一或更多个主要电阻式加热器；及复数个像素加热器，该等像素加热器与主要电阻式加热器同行并且安置于基板支撑件中。像素加热器数量是大于主要电阻式加热器数量之数量级，并且像素加热器相对于彼此及相对于主要电阻式加热器皆为独立可控的。; one or more main resistive heaters disposed in the pixelated substrate support; and a plurality of pixel heaters in column with the main resistive heaters and disposed in the substrate support. A quantity of the pixel heaters is an order of magnitude greater than a quantity of the main resistive heaters and the pixel heaters are independently controllable relative to each other as well as the main resistive heater.