发明名称 基板処理装置
摘要 <p>A substrate processing apparatus (FPA) comprises a supply roller (5b), a chamber (CB), and a collecting roller (6b). A flexible substrate (S) formed of a resin film or stainless steel foil is carried from the supply roller (5b) to the collecting roller (6b) through the chamber (CB), and is wound around the collecting roller (6b). In the chamber (CB), a liquid is applied to the substrate (S) using a transcription device (11). The supply roller (5b) moves along a first rail (3) extending in a direction (X) perpendicular to a direction (Y) in which the substrate (S) is carried. The collecting roller (6b) moves along a second rail (4) in synchronization with the supply roller (5b). Along with these movements, the substrate (S) is moved into and out of the chamber (CB). In a chamber (CB) of another apparatus (FPA2), the substrate (S) is processed using a plasma device (12).</p>
申请公布号 JP5780291(B2) 申请公布日期 2015.09.16
申请号 JP20130501091 申请日期 2012.02.22
申请人 发明人
分类号 B65H20/00;B05C13/00;B05C15/00 主分类号 B65H20/00
代理机构 代理人
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