| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a coverlay film the adhesion of which to a wiring layer is not reduced, even if it is placed in high temperature environment repeatedly, and to provide a circuit board.SOLUTION: In a coverlay film laminating an adhesive layer and a coverlay film material layer, an adhesive containing polyimide resin which contains two kinds of constitutional unit at a specific ratio, i.e., a constitutional unit consisting of tetravalent aromatic group derived from an aromatic tetracarboxylic acid anhydride containing an oxydiphthalic acid anhydride, and a bivalent diamino siloxane residue derived from diamino siloxane, and a constitutional unit consisting of a tetravalent aromatic group derived from aromatic tetracarboxylic acid anhydride containing the oxydiphthalic acid anhydride, and a bivalent aromatic diamine residue derived from aromatic diamine is used.</p> |
