| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a silver coated flake copper powder which demonstrates higher conductivity as a conductive filler without using an organic solvent and without requiring wet type heat treatment. <P>SOLUTION: In the method of manufacturing the silver coated flake copper powder, a copper powder is brought into contact with a complex solution of silver to coat a surface with the silver, then obtained powder particle is subjected to flattening treatment so as to turn an aspect ratio to 3 or larger, and thereafter the powder particle is brought into contact with the complex solution of the silver to coat the surface with the silver. At that time, it is preferable that a surface treating agent such as palmitic acid is added during the flattening treatment and/or to a final product, and the shape of copper power particle and the powder particle obtained by coating the copper powder particle with the silver is spherical. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
