| 摘要 |
<p>[Problem] To provide an electronic module that can be miniaturized and a production method for the same. [Solution] An electronic module (1) according to one embodiment is provided with: a first functional part (10) that includes a substrate (11) having an electronic part (12) attached thereto; a second functional part (20) that includes a substrate (21) having an electronic part (22) attached thereto, and connects electrically to the first functional part (10); and a heat sink (30) that cools the first functional part (10) and second functional parts (20). The heat sink (30) includes a base plate (31) to which a storage part (31a) is internally provided. The first functional part (10) is housed within the storage part (31a) such that the first substrate (11) is contacted to an inner wall of the storage part (31a) of the base plate (31). The second functional part (20) is fixed upon the base plate (31) such that the second substrate (21) is contacted to a main surface (31b) of the base plate (31).</p> |
