| 摘要 |
<p>A magnetron sputtering coating device is provided, characterized in the following aspects: The device at least includes a deposition chamber, sputtering cathodes, a rotating stand on the base of the deposition chamber and a work steady on the rotating stand, as well as a first rotation system for driving the rotating stand to rotate around the central axis of the rotating stand; the sputtering cathode, arranged around and perpendicular to the rotating stand, includes two first sputtering cathodes and one second sputtering cathode, and is located on a circumference concentric with the rotating stand; there is an arc of 180°-240° between the two first sputtering cathodes, which is equally divided by the second sputtering cathode; a baffle through the surface of the rotating stand is fixedly arranged on the rotating stand, having both ends beyond both ends of the sputtering cathode in the direction perpendicular to the rotating stand. The device is simple in structure and process control, and realizes preparation of the nano-multilayer film, suitable for industrialization.</p> |
