先进接地方案;ADVANCED GROUNDING SCHEME

摘要

层合基板可以包括定位在层合核心之腔穴内的金属块。层合基板可以具有在层合核心之任一侧上的选路层，其当中至少一者与金属块的外侧共平面。覆盖层然后可以施加到层合基板而直接耦合于金属块和选路层。于实施例，介电层可以耦合于覆盖层，并且额外的选路层可以耦合于介电层。因此，选路层可以是「内」选路层，其与金属块共平面并且耦合于金属块。 A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner”