| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electroless copper plating bath, wherein an electroless copper plating solution enables electroless copper plating at pH 3-8, the plating bath exhibits sufficient bath stability, and a metallic copper deposited film obtained has sufficient thickness, extremely good adhesion, and further, such excellent characteristics that the crystallinity of the deposited film is extremely fine, precise, and homogeneous, thereby forming an extremely precise and homogeneous metallic copper deposited film on a material to be plated which is weak to strong alkalinity and strong acidity (for example, epoxy, polyamide, alumina, etc.). <P>SOLUTION: The electroless copper plating bath includes a water-soluble copper salt, a complexing agent, a reducing agent, a buffering agent, and an additive, wherein the complexing agent is a hydroxycarboxylic acid-based complexing agent, the reducing agent is an ascorbic acid-based reducing agent, the buffering agent is a pH buffering agent, and the additive is a nitrogen-containing heterocyclic compound. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
