| 摘要 |
<p>[Problem] To provide: a method for efficiently producing a resin-bonded wire saw that stabilizes the step of cutting an ingot and that obtains a smooth wafer in which the thickness of a damaged layer on the wafer surface caused by cutting is small; and an adhesive composition for resin-bonded wire saws that is suitable for said method. [Solution] This method for producing a resin-bonded wire saw comprises: a step of applying, to the surface of a metal core wire, a paste including an adhesive composition, abrasive grains, and a solvent for dissolving the adhesive composition, said adhesive composition being used for producing resin-bonded wire saws in which abrasive grains are firmly fixed to the surface of a metal core wire by means of a resin bond, said adhesive composition for resin-bonded wire saws including, as essential components, 100 parts by weight of a novolac-type phenolic resin, 10-30 parts by weight of a resol-type phenolic resin, and 0.1-5 parts by weight of an amine-based silane coupling agent; and a heating step of heating the applied paste with infrared rays including near-infrared rays, and causing said adhesive composition to undergo a cross-linking reaction.</p> |
