发明名称 |
Improved metal to metal bonding for stacked (3D) integrated circuits |
摘要 |
The present invention provides a stabilized fine textured metal microstructure that constitutes a durable activated surface usable for bonding a 3D stacked chip. A fine-grain layer that resists self anneal enables metal to metal bonding at moderate time and temperature and wider process flexibility. |
申请公布号 |
GB201513842(D0) |
申请公布日期 |
2015.09.16 |
申请号 |
GB20150013842 |
申请日期 |
2014.01.07 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
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