Substrate wafer with optical electronic package

摘要

An electronic package includes a substrate wafer having front and rear faces and a through passage having a front window and a blind cavity communicating laterally with the front window. A receiving integrated circuit chip is mounted on the rear face and includes an optical sensor situated opposite the blind cavity. A transparent encapsulant extends above the optical sensor and at least partially fills the through passage. An emitting integrated circuit chip, embedded in the transparent encapsulant, includes an optical emitter of luminous radiation. The emitting integrated circuit chip may be mounted to the front face or within the through passage to the receiving integrated circuit chip. The substrate wafer may further include a second through passage. The receiving integrated circuit chip further includes a second optical sensor situated opposite the second through passage. A cover plate is mounted to the front face at the second through passage.

主权项

1. An electronic package, comprising:
a substrate wafer having a front face and a rear face and having an aperture comprising:
a first part extending longitudinally completely through the substrate wafer between the front face and the rear face to define a front window; anda second part extending only partially into the substrate wafer from said rear face to define a forwardly blind cavity on said rear face with a bottom surface formed by a portion of said substrate wafer intermediate between the front and rear faces, wherein the second part is in lateral communication with the first part; a receiving integrated circuit chip having a front face mounted on the rear face of the substrate wafer and comprising at least one optical sensor of luminous radiation, wherein the intermediate, bottom surface of the second part of the aperture faces towards the at least one optical sensor; a transparent encapsulant extending above said optical sensor and at least partially filling said aperture; and an emitting integrated circuit chip embedded in said transparent encapsulant and comprising an optical emitter of luminous radiation.