Three-dimensional microstructures

摘要

An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.

主权项

1. An apparatus comprising:
a) a first power combiner/divider network configured to split a first electromagnetic signal into a plurality of split electromagnetic signals, at least two of said split electromagnetic signals each connectable to at least one input of a plurality of signal processors; b) a second power combiner/divider network configured to combine at least two of a plurality of processed electromagnetic signals into a second electromagnetic signal, at least two of said plurality of processed electromagnetic signals each connectable to at least one output of said plurality of signal processors; and c) wherein at least a portion of at least one of said first power combiner/divider network and said second power combiner/divider network includes a three-dimensional coaxial microstructure,
wherein at least one of said first power combiner/divider network and said second power combiner/divider network includes a Gysel combiner/divider.