Moisture barrier for a wire bond

摘要

An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface.

主权项

1. A method of manufacturing an electronic device, comprising:
forming a wire bond, including: providing a bond pad on a substrate; bonding a wire to the bond pad, thereby forming an intermetallic compound interface; and forming a silicon nitride or silicon carbonyl layer that covers an outer surface of the intermetallic compound interface, the silicon carbonyl layer having an elemental formula of Si(CO)n where n=1-4, and the intermetallic compound interface including a first layer adjacent to the wire and a second layer adjacent to the bond pad, the second layer having a larger average grain size than the first layer.