Methods for stiction reduction in MEMS sensors

摘要

A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction.

主权项

1. A MEMS device comprising:
a MEMS actuator; a substrate opposing the MEMS actuator; and a bump stop formed on the substrate to limit motion of the MEMS actuator, wherein the bump stop is formed from a dielectric material and covered with a first conductive layer, a conductive path formed by the first conductive layer thereby substantially reducing electric charge collected on the bump stop.