LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE AND ITS MANUFACTURING METHOD

摘要

The present invention relates to a light emitting device package, backlight unit, lighting device, and manufacturing method of a light emitting device package. The light emitting device package includes: a substrate composed of an insulating combination material in which a binder and heat radiating powder are combined; an upper electrode layer which is formed on the top of the substrate, and is composed of a first electrode layer, and second electrode layer in which an electrode separation space is formed; a lower electrode layer formed on the bottom of the substrate; and a side electrode layer formed on a side of the substrate for electrically connecting the upper electrode layer, and lower electrode layer.