Electroplating composition for coating a substrate surface with a metal

摘要

The object of the present invention is an electroplating composition intended in particular for coating a copper-diffusion barrier layer with a seed layer, This composition comprises a source of copper ions, in a concentration of between 0.4 and 40mM; at least one copper complexing agent chosen from the group of primary aliphatic amines, secondary aliphatic amines, tertiary aliphatic amines, aromatic amines, nitrogen heterocycles and oximes; the copper/complexing agent(s) molar ratio being between 0.1 and 2.5, preferably between 0.3 and 1.3; and the pH of the composition being less than 7, preferably between 3.5 and 6.5.

主权项

1. An electroplating composition in solution form suitable for providing a copper coating on a copper-diffusion barrier layer in the fabrication of interconnects for integrated circuits, comprising:
a solvent: a source of cupric ions, in a concentration between 0.4 and 18 mM; and a mixture of pyridine and 2,2′-bipyridine as complexing agents for the cupric ions; a molar ratio of the cupric ion/the complexing agents being between 0.1 and 2.5; the cupric ions forming a complex with the complexing agents in the solution; and the pH of the composition being in a range suitable for the pyridine and bipyridine to be in an unprotonated state and not higher than 6.5.