| 发明名称 | Light emitting device package and light unit including the same | ||
| 摘要 | Disclosed are a light emitting device package and a light unit including the same. The light emitting device package includes a body; a first lead frame having a first cavity in a first region of the body; a second lead frame having a second cavity in a second region of the body; a first bonding part adjacent to a first lateral side of the body and extended from the first cavity of the first lead frame; a second bonding part adjacent to a second lateral side of the body, which is opposite to the first lateral side of the body, and extended from the second cavity of the second lead frame; a first light emitting device in the first cavity; a second light emitting device in the second cavity; a third cavity adjacent to the first bonding part; a first protective device in the third cavity. | ||
| 申请公布号 | US9136451(B2) | 申请公布日期 | 2015.09.15 |
| 申请号 | US201313891014 | 申请日期 | 2013.05.09 |
| 申请人 | LG INNOTEK CO., LTD. | 发明人 | Lee Dong Yong |
| 分类号 | H01L33/00;H01L33/62;H01L25/16;H01L33/64 | 主分类号 | H01L33/00 |
| 代理机构 | Ked & Associates, LLP | 代理人 | Ked & Associates, LLP |
| 主权项 | 1. A light emitting device package comprising: a body formed of an insulating material and having a recess; a first lead frame having a first cavity in the recess of the body; a second lead frame having a second cavity in the recess of the body; a first bonding part connected to the first lead frame on a bottom of the recess; a second bonding part connected to the second lead frame on a bottom of the recess; a first light emitting device in the first cavity; a second light emitting device in the second cavity; a third cavity spaced apart from the first and second cavities and disposed in the recess; a first protective device disposed in the third cavity and connected to at least one of first and second light emitting devices; and a molding member disposed in the recess. | ||
| 地址 | Seoul KR | ||