| 摘要 |
<p>AN APPARATUS (200) FOR DELIVERING SEMICONDUCTOR COMPONENTS (212) TO A SUBSTRATE (206A; 206B; 500A; 500B; 500C) DURING SEMICONDUCTOR PACKAGE MANUFACTURING. THE APPARATUS (200) COMPRISES A PLATFORM (216) AND A PLURALITY OF DELIVERY MODULES (202A, 202B) AFFIXED TO THE PLATFORM (216). EACH OF THE PLURALITY OF DELIVERY MODULES (202A, 202B) HAS A SUPPORT DEVICE (204A; 204B) FOR SUPPORTING THE SUBSTRATE (206A; 206B; 500A; 500B; 500C), AS WELL AS A DELIVERY DEVICE (208A; 208B) FOR DELIVERING THE SEMICONDUCTOR COMPONENTS (212) TO THE SUBSTRATE (206A; 206B; 500A; 500B; 500C). IN PARTICULAR, HEIGHTS OF THE SUPPORT DEVICES (204A, 204) ARE MUTUALLY LEVELED FOR CONVEYING THE SUBSTRATE (206A; 206B; 500A; 500B; 500C) BETWEEN THE PLURALITY OF DELIVERY MODULES (202A, 202B). (FIGURE 2)</p> |
