| 摘要 |
Embodiments of the present invention relate to die-to-die bonding and configurations of an integrated circuit (IC) package associated therewith. In one embodiment, a package assembly includes a package substrate having a solder resist layer disposed on a first side, and a second side disposed opposite to the first side; a first die mounted on the first side, and having an active side that is electrically coupled with the package substrate by one or more first die-level interconnects; and a second die bonded to the active side of the first die by using one or more second die-level interconnects, wherein at least a portion of the second die is disposed in a cavity that extends to the solder resist layer. Other embodiments may be disclosed and/or claimed. |
