Optical electronic package having a blind cavity for covering an optical sensor

摘要

An electronic package includes a substrate wafer having front and rear faces. An emitting integrated circuit chip is mounted to the front face of the substrate wafer and includes a light radiation optical emitter. A receiving integrated circuit chip is also mounted to the front face of the substrate wafer and includes at least one light radiation optical sensor. A transparent encapsulant extends above the optical sensor and the optical emitter. An opaque encapsulant encapsulates the transparent encapsulant. The opaque encapsulant has a front window situated above the optical emitter and which is offset laterally relative to the optical sensor. The transparent encapsulant accordingly has an uncovered front face situated above the optical emitter and offset laterally relative to the optical sensor. The opaque encapsulant may include an additional front window. The receiving integrated circuit chip further includes a second optical sensor situated opposite the additional front window.

主权项

1. An electronic package, comprising:
a substrate wafer having a front face and a rear face; an emitting integrated circuit chip having a rear face fixed to the front face of the substrate wafer and comprising a light radiation optical emitter; a receiving integrated circuit chip having a rear face fixed to the front face of the substrate wafer and comprising at least one light radiation optical sensor; a transparent encapsulant extending above the light radiation optical sensor and the light radiation optical emitter; and an opaque encapsulant encapsulating the transparent encapsulant, this opaque encapsulant having a front window which is situated above the light radiation optical emitter and which is offset laterally relative to the light radiation optical sensor, so that the transparent encapsulant has an uncovered front face situated above the light radiation optical emitter and offset laterally relative to the light radiation optical sensor and so that the transparent encapsulant extends in a cavity of the opaque encapsulant, this cavity being blind towards the front and open laterally on the side of the front window such that the opaque encapsulant completely covers the light radiation optical sensor from above.