| 摘要 |
<p>An apparatus to manufacture a vacuum pad attached to a robot arm to transfer glass for a semiconductor, a wafer, and an LCD comprises: a coating device coating an adhesive on an aluminum plate forming the vacuum pad; a mold storing a pad to be attached on the aluminum plate, pressure-molding to attach the aluminum plate and the pad; and a cutting device cutting a structure consisting of the attached pad and the aluminum plate, and manufacturing a plurality of vacuum pads.</p> |
