| 摘要 |
An embodiment of the present invention relates to an electronic apparatus with a new configuration capable of suppressing the warpage of a substrate when a connector is attached or detached in the assembly, maintenance, and repair operations of the electronic apparatus. The electronic apparatus according to the embodiment of the present invention, for example, includes a housing, the substrate, the connector, and a suppressing member. The housing has a first wall part. The substrate is received in the housing and includes a first surface of the first wall part and a second surface which is opposite to the first wall part, and follows the first wall part when the substrate is separated from the first wall part. The connector is installed on the second surface. The suppressing member is installed between the first surface and the first wall part, at least partially overlaps the connector in a thickness direction and suppresses the warpage of the substrate. |
