发明名称 INSULATING SUBSTRATE AND SEMICONDUCTOR DEVICE
摘要 On a ceramic board (2), a thermosetting double-sided adhesive insulating resin (3) is disposed, and on the thermosetting double-sided adhesive insulating resin (3), a metal plate (4) is disposed. The metal plate (4) is bonded to an upper surface of the ceramic board (2) by means of the thermosetting double-sided adhesive insulating resin (3). The thermosetting double-sided adhesive insulating resin (3) is low cost, and has no problem in the aspect of member supply. Since the thermosetting double-sided adhesive insulating resin (3) eliminates a difference between a linear expansion coefficient of the ceramic board (2) and that of the metal plate (4), breakage of the ceramic board (2), and peeling of the ceramic board (2) and the metal plate (4) from each other when heated can be eliminated. Furthermore, since adhesiveness can be maintained by means of the thermosetting double-sided adhesive insulating resin (3), generation of voids can be eliminated. As a result, reliability of a product can be improved. Furthermore, since the thermosetting double-sided adhesive insulating resin (3) cures when molded with heat, molding can be performed.
申请公布号 WO2015132969(A1) 申请公布日期 2015.09.11
申请号 WO2014JP56027 申请日期 2014.03.07
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 HIRAOKA, AKINORI;KURIAKI, KAZUHIRO
分类号 H01L23/12 主分类号 H01L23/12
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