CONDUCTIVE PASTE, CONNECTION STRUCTURE, AND PRODUCTION METHOD FOR CONNECTION STRUCTURE

摘要

Provided is a conductive paste that enables solder particles to be effectively arranged on an electrode and conduction reliability between electrodes to be increased. The conductive paste according to the present invention contains a heat-curable component and a plurality of solder particles, and when the heat-curable component and the solder particles are each heated at a temperature elevation rate of 10℃/minute and subjected to differential scanning calorimetry, the temperature of the exothermic peak top during the full curing of the heat-curable component is higher than the temperature of the endothermic peak top during the melting of the solder particles. The absolute difference between the temperature of the exothermic peak top during the full curing of the heat-curable component and the temperature of the endothermic peak top during the melting of the solder particles is 10-70℃ inclusive.