| 摘要 |
The present invention is a solder supply apparatus, which comprises a solder cup (70) which contains solder, in fluid form, in the interior of the same and a supply nozzle (74) which is fitted within the solder cup, and which moves the solder cup by way of supply of air to a space (86) and supplies solder within the solder cup, wherein if the movement distance of the solder cup is less than a set distance (volume of the space is less than a predetermined volume), a predetermined amount of air is supplied, and if the movement distance of the solder cup is greater than or equal to the set distance (the volume of the space is greater than or equal to the predetermined volume), an amount of air more than the predetermined amount is supplied. As a result, even if the volume of the space is greater than or equal to the predetermined volume, it becomes possible to supply an amount of solder that is equivalent to the solder supply amount if the volume of the space is less than the predetermined volume, and therefore, it becomes possible to control operation of the solder supply apparatus by taking into consideration the difference in hydraulic head. |
