| 摘要 |
The present invention is a manufacturing method for a connecting structure having: a placement step which places a first circuit member (10), which is provided with a first terminal part (12) in which first terminals (12a) are arranged and a resist (13) which is formed around the first terminal part (12) and has a thickness greater than the height of the first terminals (12a), and a second circuit member (20), which is provided with a second terminal part (22) in which second terminals (22a), of a height lower than the first terminals (12a), are arranged, said first circuit member (10) and said second circuit member (20) being interposed by a circuit connecting material (30) having a first layer (31), which contains a film-forming resin and a polymerizable compound and is in contact with the first circuit member (10), and a second layer (32), which contains a film-forming resin, a polymerizable compound, a polymerization initiator, and conductive particles and is in contact with the second circuit member (20); and a compression step which performs thermocompression bonding on the first circuit member (10) and the second circuit member (20) at a predetermined temperature so as to acquire a connecting structure. |
