| 摘要 |
Provided are a mold release film, a method for manufacturing the same, and a method for manufacturing a semiconductor package using the mold release film. The mold release film is not easily charged and curled, does not contaminate a mold, and has excellent mold followability. In a method for manufacturing a semiconductor package in which a semiconductor element is arranged in a mold and the mold is sealed with a curable resin, thereby forming a resin-sealed portion, the mold release film is arranged on a surface with which the curable resin on the mold is in contact. The mold release film is provided with a first thermoplastic resin layer being in contact with the curable resin during the formation of the resin-sealed portion, a second thermoplastic resin layer being in contact with the mold during the formation of the resin-sealed portion, and an intermediate layer being arranged between the first thermoplastic resin layer and the second thermoplastic resin layer. The storage elastic moduli of the first thermoplastic resin layer and the second thermoplastic resin layer at 180°C are respectively 10-300 MPa, the difference in the storage elastic modulus at 25°C is 1,200 MPa or less, the thickness is 12-50 μm, and the intermediate layer includes a polymeric antistatic agent. |
