发明名称 WARPAGE CONTROL FOR FLEXIBLE SUBSTRATES
摘要 A flexible substrate having a first side and a second side may be provided. A device may be electrically connected to the first side of the flexible substrate through one or more electrical connections. A warpage control device may be attached to the second side of the flexible substrate. The warpage control device may include an adhesive layer and a rigid layer. The warpage control device may be formed in an area on the second side of the flexible substrate that may face the electrical connections on the first side of the flexible substrate.
申请公布号 KR20150103648(A) 申请公布日期 2015.09.11
申请号 KR20150120038 申请日期 2015.08.26
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 YU CHEN HUA;LIN SHIH TING;LIN JING CHENG;HOU SHANG YUN;LU SZU WEI
分类号 H01L23/14;H01L23/12;H01L23/28;H01L23/498;H01L23/538 主分类号 H01L23/14
代理机构 代理人
主权项
地址