发明名称 BONDING DEVICE
摘要 The bonding device comprises a table (52) provided to be movable in a Y-axis direction with respect to a base (41), a first reaction member (58A) and a second reaction member (58B) respectively provided to be movable in the Y-axis direction with respect to the base (41). The first reaction member (58A) and the second reaction member (58B) are constituted in such a way as to move, when the table (52) moves in the Y-axis direction, in the opposite direction to the table (52) in the Y-axis direction. The first reaction member (58A) and the second reaction member (58B) are disposed respectively on both sides in the X-axis direction of the table (52). The first reaction member (58A) and the second reaction member (58B) are disposed in such a way that the center of gravity of the first reaction member (58A) and second reaction member (58B) is at a position that is based on the center of gravity of the table (52). In this way, a bonding device is provided, capable of improving the weight balance at the base while suppressing an increase in space.
申请公布号 WO2015132994(A1) 申请公布日期 2015.09.11
申请号 WO2014JP76151 申请日期 2014.09.30
申请人 SHINKAWA LTD. 发明人 KAKUTANI OSAMU;TAZAWA HIDEHIRO;TUJI MASAHITO
分类号 H01L21/52;H01L21/60 主分类号 H01L21/52
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