| 摘要 |
In a pressure sensor chip according to the present invention, a non-bonding region (SA) which communicates with a peripheral part of a pressure introduction hole (11-2b), and an annular groove (11-2d) continuous with the non-bonding region (SA) are provided in part of a plane (PL) parallel to a pressure receiving surface of a sensor diaphragm (11-1) inside a stopper member (11-2). The cross-sectional shape of a first groove (11-2d1) which is dug on one side opposite to the sensor diaphragm (11-1) with the plane including the non-bonding region (SA) of the stopper member (11-2) therebetween of the annular groove (11-2d) includes a circular arc greater than or equal to a semicircle, and the cross-sectional shape of a second groove (11-2d2) dug on the other side includes a circular arc smaller than or equal to a semicircle. The second groove (11-2d2) is shifted closer to the pressure introduction hole (11-2b) side than the first groove (11-2d1). Ends of the circular arcs facing each other of the groove (11-2d1) and the groove (11-2d1) are not aligned. Consequently, expected withstanding pressure can be ensured by preventing stress concentration on a diaphragm edge. |
