发明名称 |
BAKING TOOL FOR IMPROVED WAFER COATING PROCESS |
摘要 |
Baking methods and tools for improved wafer coating are described. In one embodiment, a method of dicing a semiconductor wafer including integrated circuits involves coating a surface of the semiconductor wafer to form a mask covering the integrated circuits. The method involves baking the mask with radiation from one or more light sources. The method involves patterning the mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the substrate between the ICs. The method may also involves singulating the ICs, such as with a plasma etching operation. |
申请公布号 |
WO2015134200(A2) |
申请公布日期 |
2015.09.11 |
申请号 |
WO2015US16647 |
申请日期 |
2015.02.19 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
PARK, JUNGRAE;LEI, WEI-SHENG;PAPANU, JAMES S.;EATON, BRAD;KUMAR, AJAY |
分类号 |
H01L21/301;H01L21/78 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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