ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MOUNTING FLIP CHIP

摘要

The purpose of the present invention is to provide an electronic component mounting adhesive that can achieve sufficient solder bonding within a short mounting time while suppressing solder flow, that suppresses voids, and that has excellent reflow resistance. Another purpose of the present invention is to provide a flip chip mounting adhesive film that includes the electronic component mounting adhesive. The present invention is an electronic component mounting adhesive that contains: an acryl polymer that has a double bond equivalence of 1-5 meq/g and that has a methacryloyl group as a side chain; a polyfunctional methacrylate compound that has three or more functional groups; and a radical polymerization initiator.