| 摘要 |
An adjustable welding tooling for a plastic packaging IPM, comprising a substrate (1), wherein a first groove (2) for accommodating a PCB board (4) and a second groove (3) for accommodating a DBC board (5) are arranged on the substrate (1), the depth of the second groove (3) being greater than the depth of the first groove (2); and a slide block (6) is arranged at the bottom of the second groove (3), and the slide block (6) is adjustable in a longitudinal position in the second groove (3). The slide block (6) is arranged at the bottom of the second groove (3), and the slide block (6) is adjustable in the longitudinal position in the second groove (3), so that the longitudinal position of the DBC board (5) placed in the second groove (3) can be adjusted during the usage process, so as to complete brushing a solder paste onto the surfaces of a PCB board (4) and a DBC board (5) and complete the assembly with a wire frame without changing the tooling, so that a tooling device is saved, the work efficiency is improved, and the qualified rate of finished products is further improved. |
