| 摘要 |
The present invention provides a superior ion beam sputtering system, assembly and methodology, with unique capabilities for film coating the exposed surface(s) of a workpiece or substrate by physical vapor deposition. The system can have far higher throughput than existing ion beam sputtering systems, while being constructed as a drop-in module, giving it a flexibility more typically found in magnetron systems. The operational system generates and initially extracts a ribbon shaped ion beam, typically of argon, whose breadth can be extended from about 150 mm to about 3 meters; then accelerates, deflects, and then decelerates the beam to form a spacecharge neutralized high current very broad ribbon ion beam; directs this resulting ion beam to strike the exposed face surface of a sputter target at a pre-chosen oblique incidence angle near 70 degrees; and consequently q: wises the formation and release of a plume of sputtered atoms from the target. |
