| 摘要 |
An auxiliary adhesive dispensing device, connected to a printed circuit board (PCB) through an opening in the side of a shielding cover over the PCB. The auxiliary adhesive dispensing device comprises: a flow channel (1), an adhesive injection opening (2) connected to one end of the flow channel (1), and a fixed component (3) connected to the flow channel (1) and the PCB. The auxiliary adhesive dispensing device can perform adhesive dispensing operation even after second reflow soldering even if the shielding cover is installed, and does not require another second reflow soldering after finishing adhesive dispensing, thus reducing the risk of mixing adhesive dispensed chips with solder and the risk of the presence of solder beads on peripheral chips. |
