| 摘要 |
PROBLEM TO BE SOLVED: To perform sufficient power supply in a non-contact manner while constricting increase in chip size when performing transmission and reception of a variety of signals in a non-contact manner.SOLUTION: A semiconductor device 100 comprises: a semiconductor substrate having a semiconductor chip formation region 102; a chip internal circuit 124; an inductor 114 for signal transmission/reception which performs transmission/reception of a signal with the outside by electromagnetic induction in a non-contact manner and is electrically connected to the chip internal circuit 124 to perform transmission/reception of a signal with the chip internal circuit 124; and an inductor 112 for power reception which has a pathway along an outer edge of the semiconductor chip formation region 102 so as to surround the chip internal circuit 124 and the inductor 114 for signal transmission/reception, and receives a power signal from the outside in a non-contact manner, and which is electrically connected to the chip internal circuit 124. |
