RADIATION-CURABLE SILICONE COMPOSITION

摘要

To provide a radiation-curable silicone composition which provides a cured product whose odor is decreased, particularly is odorless, and has excellent curability and releasing properties. A radiation-curable silicone composition including the following components (A) and (B): (A) an epoxy group-containing cation-polymerizable organopolysiloxane which is represented by the following average composition formula (1): R1aR2bSiO(4-a-b)/2 (1) and (B) an iodonium salt having a cation moiety represented by the following general formula (2) in an effective amount to cure said component (A), [(R3)—I—(R3)]+ (2) wherein R3 is, independently of each other, a substituted or unsubstituted monovalent aromatic hydrocarbon group having 15 to 26 carbon atoms, wherein said component (A) may be accompanied by any other compounds volatilizing during heating at 105 degrees C. for 3 hours, a content of said compounds is at most 2.0 mass %, based on a total amount of component (A) and said compound.

主权项

1. A radiation-curable silicone composition comprising the following components (A) and (B):
(A) an epoxy group-containing cation-polymerizable organopolysiloxane which is represented by the following average composition formula (1):
R1aR2bSiO(4-a-b)/2  (1) wherein R1 is, independently of each other, an epoxy group-containing monovalent organic group, R2 is, independently of each other, a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, a>0, b>0 and a total of a and b is in a range of larger than 0 and at most 3, and (B) an iodonium salt having a cation moiety represented by the following general formula (2) in an effective amount to cure said component (A),
[(R3)—I—(R3)]  (2) wherein R3 is, independently of each other, a substituted or unsubstituted monovalent aromatic hydrocarbon group having 15 to 26 carbon atoms,wherein said component (A) may be accompanied by any other compounds volatilizing during heating at 105 degrees C. for 3 hours, a content of said compounds is at most 2.0 mass %, based on a total amount of component (A) and said compound.