| 摘要 |
FIELD: chemistry.SUBSTANCE: reinforced epoxide adhesive composition includes a liquid epoxy diane resin with 20.0-22.5% epoxy groups, dicyandiamide and additionally contains a product of polycondensation of phenylol propane with 4,4'-dichlorodiphenylsulphone, filler in the form of hollow glass microspheres with a bulk density of 250.0-300.0 kg/mand quartz fabric.EFFECT: wide range and enabling variation of dielectric properties, use in modern wideband multilayer radio engineering structures.2 cl, 2 tbl, 6 ex |
