发明名称 Package Substrate, OLED Display Panel and Manufacturing Method Thereof, and Display Apparatus
摘要 A package substrate for packaging OLED devices, an OLED display panel and a manufacturing method thereof, and a display apparatus are provided. The package substrate comprises a first base substrate and a desiccant layer provided on the first base substrate, wherein the desiccant layer comprises desiccant particles and a glue layer for fixing the desiccant particles. The OLED display panel comprises the above package substrate and an array substrate, wherein the array substrate comprises OLED devices, and the array substrate and the package substrate are aligned and assembled into the OLED display panel. The method for manufacturing an OLED display panel comprises: forming a desiccant layer on a first base substrate to prepare a package substrate; forming OLED devices on a second base substrate to prepare an array substrate; aligning and assembling the array substrate and the package substrate. The display apparatus comprises the above OLED display panel.
申请公布号 US2015255750(A1) 申请公布日期 2015.09.10
申请号 US201314235614 申请日期 2013.09.18
申请人 BOE Technology Group Co., Ltd. 发明人 Sun Zhongyuan;Guo Wei
分类号 H01L51/52;H01L27/32;H01L51/56 主分类号 H01L51/52
代理机构 代理人
主权项 1. A package substrate for packaging OLED devices, comprising: a first base substrate; a desiccant layer provided on the first base substrate, which comprises desiccant particles and a glue layer for fixing the desiccant particles.
地址 Beijing CN