SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD

摘要

According to one embodiment, a semiconductor manufacturing device includes a first stage, a second stage, a transfer unit, and a detector. The first stage corrects a position of the semiconductor chip. The second stage supports an object into which the semiconductor chip is to be installed. The transfer unit transfers the semiconductor chip picked up from the first stage to the second stage. The detector detects an elastic wave from the semiconductor chip. The detector is attached to at least one of the first stage and the second stage.

主权项

1. A semiconductor manufacturing device comprising:
a first stage on which a semiconductor chip is mounted, and that corrects a position of the semiconductor chip; a second stage that supports an object into which the semiconductor chip is to be installed; a transfer unit configured to transfer the semiconductor chip picked up from the first stage to the second stage, and mounting the semiconductor chip on the object; and a detector attached to at least one of the first stage and the second stage, that detects an elastic wave from the semiconductor chip.