发明名称 FORMING A VTFT WITH ALIGNED GATE
摘要 A method of forming a gate layer of a thin film transistor includes providing a substrate including a gate structure having a reentrant profile. A conformal conductive inorganic thin film is deposited over the gate structure and in the reentrant profile. A photoresist is deposited on the conformal conductive inorganic thin film over the gate structure and filling the reentrant profile. The photoresist is exposed from a side of the photoresist opposite the substrate allowing the photoresist in the reentrant profile to remain unexposed. The conformal conductive inorganic thin film is etched in areas not protected by the photoresist to form a patterned conductive gate layer located in the reentrant profile of the gate structure.
申请公布号 US2015255292(A1) 申请公布日期 2015.09.10
申请号 US201414198672 申请日期 2014.03.06
申请人 Nelson Shelby Forrester;Tutt Lee William 发明人 Nelson Shelby Forrester;Tutt Lee William
分类号 H01L21/28;H01L29/66 主分类号 H01L21/28
代理机构 代理人
主权项 1. A method of forming a gate layer of a thin film transistor comprising: providing a substrate including a gate structure having a reentrant profile; depositing a conformal conductive inorganic thin film over the gate structure and in the reentrant profile; depositing a photoresist on the conformal conductive inorganic thin film over the gate structure and filling the reentrant profile; exposing the photoresist from a side of the photoresist opposite the substrate allowing the photoresist in the reentrant profile to remain unexposed; and etching the conformal conductive inorganic thin film in areas not protected by the photoresist to form a patterned conductive gate layer located in the reentrant profile of the gate structure.
地址 Pittsford NY US