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发明名称
THROUGH-HOLE FORMING METHOD, MEMBER, INK JET HEAD, INK JET HEAD UNIT, AND INK JET RECORDING APPARATUS
摘要
A through-hole forming method includes applying etching and laser machining to a substrate to form a through-hole.
申请公布号
US2015251425(A1)
申请公布日期
2015.09.10
申请号
US201514639914
申请日期
2015.03.05
申请人
SEIKO EPSON CORPORATION
发明人
YAMAZAKI Yutaka
分类号
B41J2/16
主分类号
B41J2/16
代理机构
代理人
主权项
1. A through-hole forming method comprising applying etching and laser machining to a substrate to form a through-hole.
地址
Tokyo JP
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