发明名称 THROUGH-HOLE FORMING METHOD, MEMBER, INK JET HEAD, INK JET HEAD UNIT, AND INK JET RECORDING APPARATUS
摘要 A through-hole forming method includes applying etching and laser machining to a substrate to form a through-hole.
申请公布号 US2015251425(A1) 申请公布日期 2015.09.10
申请号 US201514639914 申请日期 2015.03.05
申请人 SEIKO EPSON CORPORATION 发明人 YAMAZAKI Yutaka
分类号 B41J2/16 主分类号 B41J2/16
代理机构 代理人
主权项 1. A through-hole forming method comprising applying etching and laser machining to a substrate to form a through-hole.
地址 Tokyo JP