EMBEDDED DIE FLIP-CHIP PACKAGE ASSEMBLY

摘要

Embodiments of the present disclosure describe integrated circuit (IC) package assemblies and methods of fabricating IC package assemblies. These embodiments include dies embedded in embedding substrates to provide larger pitch interconnects to facilitate coupling to substrates or circuit boards through flip chip techniques. The embedding substrates may contain conductive pathways for coupling die contacts to larger pitch contacts located on the embedding substrate. By embedding the dies in the embedding substrates, dies having smaller pitch contacts can be used in package assemblies with larger pitch components without the need for silicon interposers and without having to utilize more stringent pick and place operations. Other embodiments may be described and/or claimed.

主权项

1. A package assembly comprising:
a die including a first set of contacts having a first pitch; an embedding substrate at least partially encapsulating the die and including a second set of contacts having a second pitch; conductive pathways defined in the embedding substrate to electrically couple the first set of contacts with the second set of contacts; and a package substrate configured to receive the die and embedding substrate in a flip-chip configuration, having a first side and a second side disposed opposite the first side and including:
a third set of contacts disposed on the first side having a third pitch substantially equal to the second pitch; anda fourth set of contacts on the second side having a fourth pitch;wherein the second pitch is greater than the first pitch.