| 摘要 |
A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconductor chip, and hanging lead portions supporting the supporting portion. Each of the lead terminal portions adjacent to the hanging lead portion is a chamfered lead terminal portion having, at its head, a chamfered portion formed substantially in parallel with the hanging lead portion so as to avoid interference with the hanging lead portion. |
| 主权项 |
1. A semiconductor device, comprising:
a semiconductor chip having a plurality of electrodes on the surface thereof, a plurality of lead terminal portions for external connection, hanging lead portions coupled to a supporting portion on which the semiconductor chip is mounted, metal wires for respectively connecting the lead terminal portions and the electrodes of the semiconductor chip to each other, and a sealing resin for sealing the semiconductor chip and the metal wires in such a manner that a part of each lead terminal portion is exposed, wherein lead terminal portions among the plurality of the lead terminal portions arranged adjacent to the hanging lead portions each have an corner-etched portion at an end closer to the semiconductor chip, the corner-etched portion has a side that is substantially along an adjacent one of the hanging lead portions, and four pairs of the corner-etched portions are placed across the corresponding hanging lead portions, wherein the plurality of lead terminal portions includes successively adjacent lead terminal portions each having a head side confronting the semiconductor chip, and each of the head sides confronts a corresponding one of the head sides across the semiconductor chip, and wherein the plurality of lead terminal portions are arranged in an area that is wider than the supporting portion in a side view. |
