| 发明名称 |
Power Semiconductor Package |
| 摘要 |
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can. |
| 申请公布号 |
US2015255376(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201514717099 |
申请日期 |
2015.05.20 |
| 申请人 |
International Rectifier Corporation |
发明人 |
Standing Martin |
| 分类号 |
H01L23/492;H01L23/04;H01L23/06;H01L23/14;H01L23/00 |
主分类号 |
H01L23/492 |
| 代理机构 |
|
代理人 |
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| 主权项 |
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| 地址 |
El Segundo CA US |
