EMBEDDED SYSTEM IN PACKAGE

摘要

In some embodiments, a system and/or method may include forming a semiconductor device package assembly. The method may include forming a substrate including a first surface and a second surface substantially opposite the first surface. The substrate may include an opening in the second surface. The first surface may include a first set of electrical conductors. The method may include positioning a first die in the opening. The first die may include a second set of electrical conductors. The method may include forming a third set of electrical conductors on a second die. The third set of conductors may include a first width and a first height. The method may include forming a fourth set of electrical conductors on the second die. The fourth set of conductors may include a second width and a second height. The second width may be less than the first width. The second height may be greater than the first height.

主权项

1. A method for forming a semiconductor device package assembly, comprising:
forming a substrate comprising a first surface and a second surface substantially opposite the first surface, wherein the substrate comprises an opening in the second surface, and wherein the first surface comprises a first set of electrical conductors; positioning a first die in the opening, wherein the first die comprises a second set of electrical conductors; forming a third set of electrical conductors on a second die, wherein the third set of conductors comprise a first width and a first height; forming a fourth set of electrical conductors on the second die, wherein the fourth set of conductors comprise a second width and a second height, wherein the second width is less than the first width and the second height is greater than the first height; electrically coupling the second die to the first die using the fourth set of electrical conductors and the second set of electrical conductors; electrically coupling the second die to the second surface using the third set of electrical conductors; and electrically coupling the third set of electrical conductors to at least some of the first set of electrical conductors.