MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To miniaturize contact holes, and to ensure electrode contacts in a semiconductor device even if the contact holes is the miniaturized contact holes.SOLUTION: A multilayer interlayer insulation film made of a silicified film and a resin material film is formed. Then, contact holes are formed. In this case, size of the contact holes formed in the silicified film is made smaller than size of the contact holes formed in the resin material film. This structure can make it easy to make contacts even if a pattern is complex.